Microstructural evolution during film growth

Petrov, I.; Barna, P. B.; Hultman, L.; Greene, J. E.

doi:doi:10.1116/1.1601610

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Journal of Vacuum Science & Technology A / Volume 21 / Issue 5 / ARTICLES

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J. Vac. Sci. Technol. A 21, S117 (2003); http://dx.doi.org/10.1116/1.1601610 (12 pages)

Microstructural evolution during film growth

I. Petrov¹, P. B. Barna², L. Hultman³, and J. E. Greene¹

¹Frederick Seitz Materials Research Laboratory and Department of Materials Science, University of Illinois, Urbana, Illinois 61801
²Research Institute for Technical Physics and Materials Science, Hungarian Academy of Sciences, Budapest H-1325, Hungary
³Thin Film Division, Physics Department, Linköping University, S-581 83 Linköping, Sweden

(Published online 2 September 2003)

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Atomic-scale control and manipulation of the microstructure of polycrystalline thin films during kinetically limited low-temperature deposition, crucial for a broad range of industrial applications, has been a leading goal of materials science during the past decades. Here, we review the present understanding of film growth processes—nucleation, coalescence, competitive grain growth, and recrystallization—and their role in microstructural evolution as a function of deposition variables including temperature, the presence of reactive species, and the use of low-energy ion irradiation during growth. © 2003 American Vacuum Society.