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J. Vac. Sci. Technol. A 30, 01A127 (2012); http://dx.doi.org/10.1116/1.3664090 (10 pages)
Reaction mechanisms for atomic layer deposition of aluminum oxide on semiconductor substrates
(Published online 2 December 2011)
© 2012 American Vacuum Society
Article Outline
- INTRODUCTION
- EXPERIMENTAL DETAILS
- THEORETICAL DETAILS
- RESULTS
- Growth inhibition from the second reaction cycle
- TMA chemisorption versus ligand exchange reaction
- TMA chemisorption reactions with multiple surface sites
- TMA chemisorption reaction I
- TMA chemisorption reactions I, II versus III
- Chemisorption of two TMA molecules in close vicinity
- H
2
O reaction in the first TMA/H
2
O reaction cycle
- Hydrolysis of SiCH 3 or GeCH 3 surface species
- Hydrolysis of Si 7 H 8 O 4 (AlCH 3 ) 2 , Ge 7 H 8 O 4 (AlCH 3 ) 2 and Ge 7 H 8 S 4 (AlCH 3 ) 2
- DISCUSSION
- CONCLUSIONS
KEYWORDS and PACS
Keywords
adsorption, aluminium compounds, atomic layer deposition, density functional theory, inhibitors, water, X-ray fluorescence analysis
PACS
-
Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.)
-
Specific chemical reactions; reaction mechanisms
-
X-ray, Mössbauer, and other γ-ray spectroscopic analysis methods
-
Nucleation and growth
-
Adsorption kinetics
-
Density functional theory, local density approximation, gradient and other corrections
RELATED DATABASES
Accepted 31 October 2011
Published online 2 December 2011
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