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J. Vac. Sci. Technol. B 28, 353 (2010); http://dx.doi.org/10.1116/1.3359591 (6 pages)

Investigation of Cu–Al surface alloy formation on Cu substrate

Shrikrishna Dattatraya Sartale1 and Michiko Yoshitake2

1Department of Physics, University of Pune, Ganeshkhind, Pune 411-007, India
2Advanced Electronic Materials Centre, National Institute for Materials Centre, 3-13 Sakura, Tsukuba, Ibaraki 305-0003, Japan

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(Published online 23 March 2010)

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The authors investigated the Cu–Al surface alloy formation by depositing thin films of Al by radio frequency magnetron sputtering on commercially available pure copper substrates kept at different temperatures. The crystal structure and composition of the alloys were studied by x-ray diffraction and x-ray photoelectron spectroscopy. Despite the polycrystalline nature of the copper substrate, CuAl alloy films are highly oriented along the Cu(111) direction. The deposition of Al onto Cu substrates in the temperature range from 450 to 500 °C leads to a mixture of intermetallic Cu9Al4 and αCu phases. However, 525 °C deposition temperature is enough to get αCu solid solution. These findings can be replicated on Cu single crystals to get a CuAl alloy free from intermetallic phases, which can be used as a substrate to fabricate an electron emitter with a metal-insulator-metal structure.

© 2010 American Vacuum Society

ACKNOWLEDGMENTS

The authors are grateful to the National Institute for Materials Science, Tsukuba, Japan and CAS and CNQS programs of University of Pune for financial support.

Article Outline

  1. INTRODUCTION
  2. EXPERIMENT
  3. RESULTS AND DISCUSSION
  4. CONCLUSIONS

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1071-1023 (print)  
1520-8567 (online)

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