Plasma etching of polydimethylsiloxane: Effects from process gas composition and dc self-bias voltage

Bjørnsen, Geir; Roots, Jaan

doi:doi:10.1116/1.3521489

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Journal of Vacuum Science & Technology B / Volume 29 / Issue 1 / Articles

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J. Vac. Sci. Technol. B 29, 011001 (2011); http://dx.doi.org/10.1116/1.3521489 (6 pages)

Plasma etching of polydimethylsiloxane: Effects from process gas composition and dc self-bias voltage

Geir Bjørnsen¹ and Jaan Roots²

¹Faculty of Science and Engineering, Vestfold University College, P.O. Box 2243, N-3103 Tønsberg, Norway
²Department of Chemistry, University of Oslo, P.O. Box 1033, Blindern, N-0315 Oslo, Norway

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(Published online 4 January 2011)

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Films made of polydimethylsiloxane elastomers have been etched using reactive ion etching. The elastomers are etched using different mixtures of CF₄, SF₆, and O₂ as process gases. The etch rate and profile of the etched area are measured as function of the process pressure for different process gas compositions. At low pressure the highest etch rate is achieved in SF₆+O₂ plasma. At high pressure the highest etch rate is achieved in CF₄+SF₆+O₂ plasma. The profile of the etched surface is strongly dependent on the process gas composition and the dc bias voltage in the plasma.

Article Outline

INTRODUCTION
EXPERIMENT
RESULTS AND DISCUSSION
1. Pressure dependence of the dc bias
2. Etch rate of the pure PDMS elastomer
3. Etch profiles
4. Comparison with Sylgard-184
CONCLUSION

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KEYWORDS and PACS

Keywords

elastomers, high-pressure effects, polymer films, sputter etching, polydimethylsiloxane (PDMS), CF4, and SF6

PACS

81.65.Cf

Surface cleaning, etching, patterning
61.41.+e

Polymers, elastomers, and plastics
62.50.-p

High-pressure effects in solids and liquids
52.77.Bn

Etching and cleaning

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History

Received 18 May 2010
Accepted 1 November 2010
Published online 4 January 2011

Digital Object Identifier

http://dx.doi.org/10.1116/1.3521489

PUBLICATION DATA

ISSN

1071-1023 (print)

1520-8567 (online)

Publisher

American Vacuum Society

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